Message #50 From:
NewsBot Date: December 6, 2006 03:37:00 PM
ENTG News Entegris Chambergard(TM) Diffuser Technology Provides Throughput Enhancement for Process Tools
CHASKA, Minn.--(BUSINESS WIRE)--Entegris’ (NASDAQ:ENTG), patented Chambergard™
technology can significantly increase wafer throughput by reducing load
lock vent-up time for deposition and etch process tools in semiconductor
manufacturing. Already widely used on 300mm deposition and etch process
tools, Chambergard fast vent diffuser technology has been shown to
reduce the time required to vent the load lock chamber by 65 percent on
installed 200mm tools, while offering a significant improvement in
particle reduction.
“Innovative application of our patented
filtration technology provides semiconductor manufacturers with a low
risk and immediate means of improving throughput and reducing particle
adders,” said Devon Kinkead, vice president
and general manager, gas microcontamination, Entegris. “The
Chambergard diffuser technology solution is an integral part of any
yield improvement and throughput enhancement program.”
Chambergard uses 0.003 micron filtration technology to maximize the
volume of ultra pure vent gas delivered to the chamber, while minimizing
the disruption of particles that may be present in the chamber.
Chambergard upgrade kits are available for most 200mm deposition and dry
etch process tools, and are easily installed with minimal downtime.
For more information, please visit Entegris at exhibit # 2B-501 at
Semicon Japan, December 6-8.
ABOUT ENTEGRIS
Entegris is the global leader in materials integrity management –
delivering a wide range of products for purifying, protecting and
transporting critical materials used in processing and manufacturing in
semiconductor and other high tech industries. Entegris is ISO
9001-certified and has manufacturing, customer service or research
facilities in the United States, China, France, Germany, Japan,
Malaysia, Singapore, South Korea and Taiwan. Additional information can
be found at www.entegris.com.