MIDLAND, Mich.,
SiC technology - which uses a man-made silicon and carbon compound with unique thermal and electrical properties as a substrate - is becoming increasingly important in the development of new high-frequency and more- efficient high-power electronics products. Some of its emerging uses are advanced radar systems, cell phone base stations, hybrid electric vehicles and power grid networks. Dow Corning is leveraging this federal funding, along with its own silicon manufacturing expertise, to accelerate the development of the SiC substrate market.
'The first phase of this program has met all its key objectives and
advanced the technology of SiC significantly,' said
'SiC technology's ultimate market success requires more than raw materials. Additional research and systems development also will be essential,' said Dow Corning Compound Semiconductor Solutions Chief Scientist Mark Loboda. 'This program provides an ideal platform for government, leading academic research institutions and commercial organizations to collaborate and share resources to improve this promising technology.'
Dow Corning has been developing SiC technology since 2003, when it acquired SiC pioneer Sterling Semiconductor Inc. Dow Corning's SiC development is underway at the company's Auburn, Mich.-based manufacturing site, which it dedicated in 2004 following the launch of the DCCSS business.
About Dow Corning (GLW)
Dow Corning Corporation (http://www.dowcorning.com) is a globally
integrated provider of materials, application technology and services, and is
focused on providing innovative technologies that help its customers to invent
the future. For more information on Dow Corning Compound Semiconductor
Solutions, visit http://www.dowcorning.com/content/compsemi/. Dow Corning
Corporation is equally owned by The Dow Chemical Company (NYSE: DOW) and
Corning Incorporated (NYSE: GLW). More than half of Dow Corning Corporation's
sales are outside the
SOURCE Dow Corning Corporation
