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Message #13
From: NewsBot
Date: December 4, 2006 03:00:00 AM

RSMI News Rim Semiconductor Completes New Technology Services Agreement with Telcordia

PORTLAND, Ore.--(BUSINESS WIRE)--Rim Semiconductor Company (OTCBB:RSMI), an innovator in video-over-copper technology, announces the completion of a new technology services agreement with Telcordia Technologies, Inc (www.telcordia.com). The new agreement continues the work completed by Telcordia in May 2006. The new agreement includes technical and performance evaluation of Rim Semiconductor’s IPSL technology, completion of a contribution to the DSL forum and disseminating these analyses to the industry.

In May 2006, Telcordia performed a detailed study of Rim Semiconductor's system. Telcordia's report, entitled "Rim Semiconductor - Analysis of System Performance," compares Rim Semi's system to the performance of VDSL2. Telcordia's detailed study utilizes transmission system models and models of the copper telephone loop plant. The Telcordia report describes the modulation system, discusses the performance analysis methodology used, and presents an array of performance results compared to VDSL2. A copy of the complete Telcordia report will be made available to prospective customers and business partners in limited circumstances.

About Rim Semiconductor

Rim Semiconductor Company (OTCBB:RSMI) develops technology for telecommunications companies to deliver demanding new video and data services with lower network costs. The company’s chips allow data to be transmitted at greater speed and across extended distances over existing copper wire—all with the highest quality of service—for a better end-user experience. For more information, visit www.rimsemi.com.

With the exception of historical information contained in this press release, this press release may include "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. These statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements, including but not limited to the following: product development difficulties; market demand and acceptance of products; the impact of changing economic conditions; business conditions in the Internet and telecommunications industries; reliance on third parties, including potential suppliers, licensors, and licensees; the impact of competitors and their products; risks concerning future technology; and other factors detailed in this press release and in the company's Securities and Exchange Commission filings. Rim Semiconductor is under no obligation to revise or update any forward looking statement in order to reflect events or circumstances that may arise in the future.

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